首页> 外文期刊>The Journal of Organic Chemistry >Low-Temperature Cross-Linking Benzocyclobutene Based Polymer Dielectric for Organic Thin Film Transistors on Plastic Substrates
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Low-Temperature Cross-Linking Benzocyclobutene Based Polymer Dielectric for Organic Thin Film Transistors on Plastic Substrates

机译:塑料基材上有机薄膜晶体管基于低温交联苯并环丁环丁烯电介质

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摘要

The synthesis of a new benzocyclobutene based polymer, PSBBB, designed as a dielectric material for use in organic thin film transistors was reported. Compared to conventional benzocyclobutene-based materials, the introduction of a butoxide substituent at the 7-position of the benzocyclobutene pendant unit on the polymer allowed PSBBB to be cross-linked at temperatures of 120 degrees C, thus rendering it compatible with the processing requirements of flexible plastic substrates. The cross-linking behavior of PSBBB was investigated by Fourier transform infrared spectroscopy and differential scanning calorimetry, demonstrating cross-linking of the polymer after curing at 120 degrees C. Bottom-gate bottom-contact organic thin film transistors were fabricated using PSBBB as dielectric, affording a performance comparable to that of other dielectric polymeric materials.
机译:报道了一种新的苯并环丁烯基的聚合物,PSBBB,设计为用于有机薄膜晶体管的介电材料。 与常规苯并环丁烯的材料相比,在聚合物上引入苯并丁烯吊坠单元的7位丁氧化物取代基使PSBBB在120℃的温度下交联,因此使其与处理要求相兼容 柔性塑料基材。 通过傅里叶变换红外光谱和差示扫描量热法研究了PSBBB的交联行为,在120摄氏度下固化后,在固化后,使用PSBBB制造底部栅极底部接触有机薄膜晶体管的交联行为。 提供与其他介电聚合物材料相当的性能。

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