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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Research on the metamorphic layer of silicon nitride ceramic under high temperature based on molecular dynamics
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Research on the metamorphic layer of silicon nitride ceramic under high temperature based on molecular dynamics

机译:基于分子动力学的高温下氮化硅陶瓷变质层的研究

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摘要

The high temperature of the grinding area at the engineering ceramic materials processing is one of the main factors affecting the quality of processing and the performance of parts. In order to reveal the law of temperature distribution of silicon, nitride ceramic grinding and its mechanism of action on surface quality. The process of machining silicon nitride ceramic material is simulated based on the established molecular dynamics model of the nanometric grinding of silicon nitride. The influence of grinding parameters on the nanometric grinding process is studied from the variation law of grinding temperature and the evolution of system energy, as well as the formation of grinding surface and metamorphic layer during machining. And the results of the experiment were compared with the theoretical research. With the increasing of grinding depth and speed of diamond grains, the energy released during the deformation and amorphous phase change of the atomic lattice get increased, and the grinding temperature get increased. The high grinding temperature will cause amorphous phase change in silicon nitride ceramics, and the amorphous atoms are recombined with the atomic bonds of the processed surface to form a metamorphic layer of the processed surface. The effect of grinding parameters on temperature changes from large to small is grinding wheel line speed, workpiece feeding speed, and grinding depth. There is an important effect on improving the surface machining quality and the service life of parts of engineering ceramics such as silicon nitride from the results of this paper, and it also plays an important role in reducing the effect of grinding temperature on the surface quality.
机译:工程陶瓷材料加工的研磨区域的高温是影响加工质量和零件性能的主要因素之一。为了揭示硅的温度分布规律,氮化物陶瓷研磨及其表面质量作用机理。基于氮化硅纳米磨削的建立的分子动力学模型,模拟了加工氮化硅陶瓷材料的过程。从研磨温度的变化规律和系统能量的变化中研究了研磨参数对纳米磨削过程的影响,以及在加工过程中形成研磨表面和变质层。将实验结果与理论研究进行了比较。随着钻石谷物的磨削深度和速度的增加,原子晶格变形和非晶相变期间释放的能量增加,研磨温度升高。高研磨温度将导致氮化硅陶瓷中的非晶相变,并且无定形原子与加工表面的原子键重新组合以形成加工表面的变质层。研磨参数对温度变化的影响从大到小于砂轮线速度,工件馈电速度和研磨深度。从本文的结果改善了工程陶瓷部分的表面加工质量和诸如氮化硅等部件的使用寿命的重要效果,并且在降低研磨温度对表面质量的影响方面也起着重要作用。

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