机译:考虑到接触轮工件界面的弹性状态的机器人带研磨中表面粗糙度预测的改进芯片厚度模型
Wuhan Univ Technol Hubei Key Lab Adv Technol Automot Components Wuhan 430070 Hubei Peoples R China;
Wuhan Univ Technol Hubei Key Lab Adv Technol Automot Components Wuhan 430070 Hubei Peoples R China;
Huazhong Univ Sci &
Technol State Key Lab Digital Mfg Equipment &
Technol Wuhan 430074 Hubei Peoples R China;
Huazhong Univ Sci &
Technol State Key Lab Digital Mfg Equipment &
Technol Wuhan 430074 Hubei Peoples R China;
Wuhan Univ Technol Hubei Key Lab Adv Technol Automot Components Wuhan 430070 Hubei Peoples R China;
Huazhong Univ Sci &
Technol State Key Lab Digital Mfg Equipment &
Technol Wuhan 430074 Hubei Peoples R China;
Robotic belt grinding; Chip-thickness model; Modulus of elasticity; Surface roughness prediction;
机译:考虑到接触轮工件界面的弹性状态的机器人带研磨中表面粗糙度预测的改进芯片厚度模型
机译:GH4169高温合金磨料带磨削的表面粗糙度预测模型基于多层射击(MLP)
机译:空气发动机刀片磨料带柔性研磨中表面粗糙度高精度预测模型
机译:磨料带磨削Ti-6AL-4V的实验与表面粗糙度预测模型
机译:均质和层状弹塑性介质的接触力学建模:表面粗糙度和粘合效应。
机译:纤维增强塑料复杂曲面的拟合及其带磨线接触的轨道优化模型
机译:考虑弹性变形和不同曲率的复合刀片机器人带磨削表面粗糙度的分析与预测