首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >An improved chip-thickness model for surface roughness prediction in robotic belt grinding considering the elastic state at contact wheel-workpiece interface
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An improved chip-thickness model for surface roughness prediction in robotic belt grinding considering the elastic state at contact wheel-workpiece interface

机译:考虑到接触轮工件界面的弹性状态的机器人带研磨中表面粗糙度预测的改进芯片厚度模型

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摘要

The elastic state at contact wheel-workpiece interface is a critical issue during robotic belt grinding process that significantly influences the finishing profile accuracy. Establishing a reasonable undeformed chip-thickness (UCT) model that suits to this operation is considered a feasible approach to clarify the cutting mechanisms. In the present paper, an elastic state-driven robotic belt grinding chip-thickness model is established to predict the workpiece surface roughness. In this new model, the combined modulus of elasticity of the contact wheel is calculated according to the formula of Young's modulus, and the exponent with respect to the effects of linear and nonlinear deflection is further determined based on the energy balance hypothesis. Experiments are conducted to verify the reasonability of the improved chip-thickness model from the perspective of surface roughness, and the findings are likely to clarify the differences in material removal mechanism between wheel grinding and robotic belt grinding essentially.
机译:接触式轮式工件接口处的弹性状态是机器人带磨削过程中的一个关键问题,从而显着影响整理轮廓精度。建立合理的未变形的芯片厚度(UCT)模型,其适合于该操作被认为是一种可行的方法来阐明切割机构。在本文中,建立弹性状态驱动的机器人带磨削芯片厚度模型以预测工件表面粗糙度。在这种新模型中,接触轮的组合模量根据杨氏模量的公式计算,并且基于能量平衡假设进一步确定了线性和非线性偏转的效果的指数。进行实验以验证改进的芯片厚度模型从表面粗糙度的角度验证了改进的芯片厚度模型的合理性,并且可能阐明了轮廓和机器人带磨削的材料去除机制的差异基本上。

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