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Ultra high frequency acoustic wave propagation in fully polymer based surface acoustic wave device

机译:基于完全聚合物的表面声波装置中的超高频声波传播

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Surface acoustic wave (SAW) device, which integrates the generation, propagation and detection of acoustic waves into the same device, has been known to be an essential functional unit for sensors and electromechanical systems. However, high substrate cost and process complexity of traditional inorganic SAW devices have triggered extensive research efforts to seek for alternative low cost solution, especially for disposable application. Poly(vinylidenefluoride)[P(VDF)] and its co-polymer, despite being promising materials for acoustic transducer with inexpensive processing technique, have rarely been used in SAW device due to exhibiting extremely low operating frequency (few tens of MHz) compared to the traditional SAW device (few hundreds of MHz to GHz) based on inorganic piezoelectric material. Here we demonstrate SAW device, which is entirely based on Poly(vinylidenefluoride-trifluoroethylene) [P(VDF-TrFE)], as piezoelectric material, offering transduction and propagation of acoustic waves with a frequency around 450 MHz. The drawbacks of the previous attempts by the others are addressed and rectified systematically to obtain high operating frequency comparable to the traditional SAW. The influence of periodicity of interdigitated transducer and thickness of polymer film on device performance is thoroughly investigated. Temperature dependent variation of resonance frequency, which can be exploited as temperature sensor in integrated systems, is also demonstrated. (C) 2019 Elsevier B.V. All rights reserved.
机译:表面声波(SAW)装置,它集成了一代,传播和声波检测到相同的装置中,已经知道,对于传感器和机电系统的基本功能单元。然而,高衬底成本和工艺传统无机SAW器件的复杂性已经引发了广泛的研究努力寻求替代低成本的解决方案,尤其是对于一次性应用。聚(偏二氟乙烯)[P(VDF)]及其共聚物,尽管是与廉价的处理技术声换能器有希望的材料,很少被在SAW器件使用,由于表现出非常低的工作频率(兆赫几十)相比基于无机压电材料的传统的SAW器件(几百几MHz至GHz)的。在这里,我们证明SAW器件,其完全是基于聚(偏二氟乙烯 - 三氟乙烯)[P(VDF-TrFE)的重复],作为压电材料,提供转导和声波的传播与大约450兆赫的频率。由他人先前尝试的缺点得到解决,系统整流,以获得较高的工作频率媲美传统的SAW。叉指式换能器和对器件性能的聚合物膜的厚度的周期性的影响被彻底调查。共振频率,它可以在集成系统被利用作为温度传感器的温度相关的变化,也证明。 (c)2019 Elsevier B.v.保留所有权利。

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