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Gold Recovery from Waste Printed Circuit Boards by Advanced Hydrometallurgical Processing

机译:通过先进的湿法冶金加工从废印刷电路板上回收

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The scope of this study was to improve the hydrometallurgical processes involving iodine-iodide leaching and precipitation for recovery of gold from waste printed circuit boards. Firstly, the influence of different precipitating agents, namely ascorbic acid, trisodium citrate and sodium hydroxide on the recovery of gold from gold-iodide leach liquor were investigated in order to define the most effective precipitating agent. The leach liquor was prepared by dissolving pure gold chips in 1:6 molar ratio of iodine-iodide solution at 40 degrees C, 550 rpm for 12 h. The variables, which affect the efficiency of gold precipitation from the leach liquor, were the molar ratio of precipitating agents to gold, pH and redox potential of the solutions. The attained high gold precipitation efficiency from the leach liquor was more than 99% under the highly acidic (pH 1.6) and alkaline conditions (pH 13) induced by 0.1 M ascorbic acid and 0.1 M sodium hydroxide respectively, but 64.5% of gold at a weak alkaline condition (pH 8) with 0.1 M trisodium citrate. Secondly, physico-chemical properties of resultant colloidal solutions and prepared gold particles were examined. Finally, recycling of waste printed circuit boards (WPCBs) via iodine-iodide leaching followed by the ascorbic acid reduction was discussed. Results indicate that over 95% of gold extracted from WPCBs by two-step iodine-iodide leaching under the defined conditions, while the dissolution efficiencies of other precious metals (Ag, Pd) and metal impurities (Cu, Al, Fe, Ni, Pb and Zn) were less than 1% and 3%, respectively. The vast majority of Au (99.8%), Cu (95.6%) and Ag (76.8%) were precipitated from the pregnant leach solution by ascorbic acid reduction at ambient conditions.
机译:该研究的范围是改善涉及碘 - 碘化物浸出和沉淀的湿法冶金方法,从废印刷电路板中恢复金。首先,研究了不同沉淀剂,即抗坏血酸,柠檬酸三钠和氢氧化钠对金 - 碘化物浸出液回收金的影响,以定义最有效的沉淀剂。通过在40℃,550rpm的碘 - 碘化物溶液的1:6摩尔比中溶解纯金芯片来制备浸出液。影响来自浸出液中的金沉淀效率的变量,是沉淀剂与溶液的金,pH和氧化还原电位的摩尔比。从浸出液中获得的高金沉淀效率在高酸性(pH <6.6)和0.1M抗坏血酸和0.1M氢氧化钠诱导的高度酸性(pH)和碱性条件(pH值13)下大于99%。64.5%在弱碱性条件下的金(pH8),柠檬酸氢酸二米酸二氢钠。其次,检查了所得胶体溶液的物理化学性质和制备的金颗粒。最后,讨论了通过碘 - 碘化物浸出的废印刷电路板(WPCB)的再循环,然后探讨了抗坏血酸还原。结果表明,在规定的条件下,通过两步碘 - 碘化物浸出,来自WPCB的95%的金,而其他贵金属(Ag,Pd)和金属杂质(Cu,Al,Fe,Ni,Pb的溶出效率Zn)分别小于1%和3%。在环境条件下通过抗坏血酸降低,绝大多数Au(99.8%),Cu(95.6%)和Ag(76.8%)沉淀出来的抗坏血酸溶液。

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