(S008-2)Wetting processes and kinetics of Sn-30Bi-0.5Cu molten alloy on different substrates

摘要

The study of wetting behavior is an important step in the characterization of solder alloys and also provides basic physicochemical data. A large number of Pb-free solder alloys have so far been proposed to find an acceptable Pb-free solder for various electronic attachment applications. Most of these solder alloys are based on Sn being the primary or major constituent. However the wetting processes of the Sn-Bi-Cu alloy on different substrates have little been reported. The purpose of this study is to investigate the reactive wetting behavior and kinetics of Sn-30Bi-0.5Cu molten alloy on Cu, Ni substrates by sessile drop method.