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Progress In non-volatile memory devices based on nanostructured materials and nanofabrication

机译:基于纳米结构材料和纳米加工的非易失性存储器件的研究进展

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摘要

Semiconductor device technology has continuously advanced through active research and the development of innovative technologies during the past decades. Semiconductor devices are expected to descend below the 10 nm scale within the next 10 years. Meanwhile, nanofabrication technology and the synthesis of nanostructured materials for novel device applications have made considerable progress too. This review will discuss new technologies that make this continuous device scaling possible. Then, recent efforts and research activities will be discussed regarding the fabrication and characterization of non-volatile memory devices made of nanostructured materials and by nanofabrication. This review concludes with an analysis of device fabrication strategies and device architectures beyond the device scaling limit with an emphasis on some promising technologies from bottom-up approaches.
机译:在过去的几十年中,通过积极的研究和创新技术的发展,半导体器件技术不断进步。预计在未来10年内,半导体器件将降至10 nm以下。同时,纳米制造技术和用于新型器件应用的纳米结构材料的合成也取得了长足的进步。这篇评论将讨论使这种连续的设备扩展成为可能的新技术。然后,将讨论有关由纳米结构材料制成并通过纳米制造的非易失性存储器件的制造和表征的最新努力和研究活动。本文以对超出器件规模限制的器件制造策略和器件架构的分析作为结束,重点是自下而上的方法中一些有前途的技术。

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