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首页> 外文期刊>Journal of nanoscience and nanotechnology >Effects of Undoped GaN Capping Layer on p-GaN Gate AlGaN/GaN Heterostructure Field-Effect Transistors
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Effects of Undoped GaN Capping Layer on p-GaN Gate AlGaN/GaN Heterostructure Field-Effect Transistors

机译:未掺杂的GaN覆盖层对p-GaN栅极AlGaN / GaN异质结构场效应晶体管的影响

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摘要

We investigated the effects of an undoped GaN (u-GaN) capping layer in normally-off p-GaN gate AlGaN/GaN heterostructure field-effect transistors (HFETs). Three types of AlGaN/GaN HFETs were fabricated: without a u-GaN capping layer, with a u-GaN capping layer, and with a stack of a u-GaN capping layer and a SiN X passivation layer. The turn-on voltages were nearly identical for all the devices, but the drain current of the device without a capping layer was significantly lower than those of the devices with a capping layer. We also observed a lower current collapse and a considerably improved electrical stability under the OFF-state stress in the devices with a u-GaN capping layer compared with the device without a u-GaN capping layer. The experimental results show that a u-GaN capping layer can effectively suppress the surface trap states in p-GaN gate AlGaN/GaN HFETs.
机译:我们研究了常关p-GaN栅极AlGaN / GaN异质结构场效应晶体管(HFET)中未掺杂的GaN(u-GaN)覆盖层的影响。制造了三种类型的AlGaN / GaN HFET:不带u-GaN覆盖层,带u-GaN覆盖层以及带u-GaN覆盖层和SiN X钝化层的叠层。所有器件的导通电压几乎相同,但是不具有覆盖层的器件的漏极电流明显低于具有覆盖层的器件的漏极电流。我们还观察到,与没有u-GaN覆盖层的器件相比,具有u-GaN覆盖层的器件在关态应力下的电流崩塌更低,并且电稳定性得到了显着改善。实验结果表明,u-GaN覆盖层可以有效抑制p-GaN栅极AlGaN / GaN HFET中的表面陷阱态。

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