Structural dependence of gold deposition by nanoplating in polycrystalline copper

摘要

In the present work, the gold-nanoplating technique is used to monitor differences in the electrochemical activity of different types of grain boundaries in high-purity copper. Gold-nanoplating is based on the electrochemical displacement of gold, which is deposited as particles from an aqueous solution on the polycrystalline copper surface. The complementary use of electron backscatter diffraction for revealing microstructural features, field emission scanning electron microscopy for imaging, and energy-dispersive X-ray analysis for quantification of the deposited gold makes it possible to detect differences in the grain boundary activity for different types of grain boundaries. In this way, it becomes possible to distinguish special from random boundaries in an efficient way. Also quantitative experimental results on grain boundary activity are produced, which correlate strongly with literature predictions on grain boundary energy.