乙酸溶液中电沉积法制备纳米晶铜组织和结晶特征

摘要

在传统硫酸沉积铜中甲烷磺酸是一种可选择的电解液.从环境友好的乙酸基电解液中电沉积铜,该电解液由乙酸铜、乙酸钠、甲烷磺酸组成.采用维生素、糖精和4-氨基-3-羟基-1-磺酸作为沉积电解液的添加剂,利用法拉第定律计算阴极电流效率,并使用Haring?Blum电池确定溶液中的金属分布比.这些添加剂影响了沉积铜薄膜的表面形貌,采用SEM和XRD手段分析其晶粒尺寸.XRD谱表明电沉积铜是多晶面心立方体结构.采用Debye?Scherrer公式计算薄膜的晶粒大小.晶体尺寸表明含电解液添加剂沉积得到的产物具有最小的晶粒尺寸.织构系数分析表明,所有的铜沉积膜都是多晶结构,晶体择优取向并平行于表面.添加剂导致了均匀的无针孔表面形貌和晶粒细化.%Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper deposition. The electrodeposition of copper from eco-friendly acetate-based electrolytes consisting of copper acetate, sodium acetate and methane sulphonic acid was dealt. Thamine hydrochloride (THC), saccharin and 4-amino-3-hydroxynaphthalene 1-suphonic acid were used as additives in depositing electrolytes. The cathode current efficiency was calculated using the Faraday's law. Metal distrbution ratio of the solutions was determined using Haring?Blum cell. These additives impact the surface morphology of deposited copper films by downgrading, the grain size was analyzed by scanning electron microscopy (SEM) and X-ray diffiraction technique. XRD pattern acquired for electrodeposited copper film shows polycrystalline and face centered cubic structure (FCC). The crystal size of the copper film was calculated using the Debye?Scherrer's equation. The crystal size revealed that deposits produced from additive containing electrolytes exhibited the lowest grain size. Texture coefficient analysis studies revealed that all copper film deposits are polycrystalline and the crystals are preferentially oriented and parallel to the surface. A uniform and pin-hole free surface morphology and grain refining were brought about by the additives.