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Low-temperature processing of porous SiC ceramics

机译:多孔SiC陶瓷的低温处理

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摘要

Porous silicon carbide ceramics were fabricated from SiC, polysiloxane, and polymer microbead (as a pore former) at a temperature as low as 800°C by a simple pressing and heat-treatment process. The effects of polysiloxane and template contents on the porosity and strength of the ceramics were investigated. During heat treatment, the polysiloxane transformed to an amorphous SiOC phase, which acted as the bonding material between SiC particles, and the polymer microbeads decomposed into gases and left pores. The porosity of porous SiC ceramics could be controlled within a range of 26-56 % with the present set of processing variables. The porous SiC ceramics showed a maximal porosity of 56 % when 10 μm SiC particles and 16 % polysiloxane were used with 20 % polymer microbeads. Flexural strength generally increased with increasing polysiloxane content and decreased with increasing polymer microbead content. Typical flexural strength of the porous SiC ceramics was 53 MPa at 42 % porosity. ? 2012 Springer Science+Business Media New York.
机译:多孔碳化硅陶瓷是由SiC,聚硅氧烷和聚合物微珠(作为造孔剂)在低至800°C的温度下通过简单的压制和热处理工艺制成的。研究了聚硅氧烷和模板含量对陶瓷孔隙率和强度的影响。在热处理过程中,聚硅氧烷转变为无定形的SiOC相,该相作为SiC颗粒之间的结合材料,聚合物微珠分解成气体和残留的孔。利用当前的一组工艺变量,可以将多孔SiC陶瓷的孔隙率控制在26-56%的范围内。当将10μmSiC颗粒和16%的聚硅氧烷与20%的聚合物微珠一起使用时,多孔SiC陶瓷的最大孔隙度为56%。弯曲强度通常随聚硅氧烷含量的增加而增加,而随聚合物微珠含量的增加而降低。在孔隙率为42%时,多孔SiC陶瓷的典型抗弯强度为53 MPa。 ? 2012年Springer Science + Business Media纽约。

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