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Experimental study of the depth influence on the band broadening effect in a cyclo-olefin polymer column containing an array of ordered pillars

机译:深度对包含有序柱阵列的环烯烃聚合物柱中谱带扩宽影响的实验研究

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摘要

An experimental study of a micromachined non-porous pillar array column performance under non-retentive conditions is presented. The same pillar structure has been fabricated in cyclo-olefin polymer (COP) chips with three different depths via hot embossing and pressure-assisted thermal bonding. The influence of the depth on the band broadening along with the already known contribution arising from the top and bottom cover plates has been studied. The experimental results exhibit reduced plate heights as low as 0.2, which are in agreement with the previous experimental work. Moreover, the constant values of the reduced Van Deemter expression are also in accordance with the previous studies. A more exhaustive study of the C-term band broadening is also presented, showing that comparing the space between the pillars with different open tubular rectangular channels offers a good estimation of the C-term band broadening that is obtained experimentally. These experimental results, hence, confirm that micromachined pillar array columns fabricated in COP can achieve the same performance as the ones fabricated in silicon for the presently studied pillar channel design.
机译:提出了在非保持条件下微机械无孔柱阵列柱性能的实验研究。通过热压花和压力辅助热粘合,在具有三种不同深度的环烯烃聚合物(COP)芯片中制造了相同的支柱结构。已经研究了深度对频带扩展的影响以及由顶部和底部盖板引起的已知贡献。实验结果表明减小的板高可低至0.2,这与以前的实验工作相符。此外,减少的Van Deemter表达的恒定值也与先前的研究一致。还提供了对C项谱带展宽的更详尽的研究,表明比较具有不同开放管状矩形通道的柱子之间的空间可以很好地估算通过实验获得的C谱带展宽。因此,这些实验结果证实了在COP中制造的微机械柱阵列柱可以实现与目前研究的柱通道设计中在硅中制造的柱柱阵列相同的性能。

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