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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Thermoelectric properties of P-type Sb_2Te_3 thick film processed by a screen-printing technique and a subsequent annealing process
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Thermoelectric properties of P-type Sb_2Te_3 thick film processed by a screen-printing technique and a subsequent annealing process

机译:通过丝网印刷技术和后续退火工艺处理的P型Sb_2Te_3厚膜的热电性能

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摘要

We herein report the thermoelectric properties of Sb_2Te_3 thick film fabricated by a screen-printing technique and a subsequent annealing process. Each step of the screen-printing fabrication process of Sb_2Te_3 thick film is described in detail. It was found that the subsequent annealing process must be carefully designed to achieve good thermoelectric properties of the screen-printed film. The results show that the annealing of the screen-printed Sb_2Te_3 thick film together with tellurium powder in the same process chamber significantly improves the carrier mobility by increasing the average scattering time of the carrier in the film, resulting in a large improvement of the power factor. By optimizing the annealing process, we achieved a maximum thermoelectric figure-of-merit, ZT, of 0.32 at room temperature, which is slightly higher than that of bulk Sb_2Te_3. Because screen-printing is a simple and low-cost process and given that it is easy to scale up to large sizes, this result will be useful for the realization of large, film-type thermoelectric devices.
机译:我们在此报告了通过丝网印刷技术和随后的退火工艺制备的Sb_2Te_3厚膜的热电性能。详细描述Sb_2Te_3厚膜的丝网印刷制造工艺的每个步骤。已经发现,必须仔细设计随后的退火工艺,以实现丝网印刷膜的良好热电性能。结果表明,在同一处理室中对丝网印刷的Sb_2Te_3厚膜和碲粉进行退火可通过增加膜中载体的平均散射时间来显着改善载流子迁移率,从而大大提高了功率因数。通过优化退火工艺,我们在室温下获得的最大热电品质因数ZT为0.32,略高于块状Sb_2Te_3。因为丝网印刷是一个简单且低成本的过程,并且鉴于它易于放大成大尺寸,所以该结果对于实现大型薄膜型热电器件将是有用的。

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