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Effects of Annealing Process on the Structural, Optical and Electrical Properties of Copper Oxide Thin Films Grown by Immersion Technique

机译:退火过程对浸泡技术生长氧化铜薄膜结构,光学和电性能的影响

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The synthesized and characterization on the growth of copper oxide thin films on fluorine-doped tin oxide (FTO) coated glass with annealing and without annealing process has been studied by immersion techniques. Furthermore, ZnO layer has been used in order to improve the absorption spectrum of CuO films. The copper oxide films were analyzed on the morphological, structural, optical and electrical by Field Emission Scanning Electron Microscopy (FESEM), X-ray diffractometer (XRD), UV-Vis spectroscopy (absorbance) and I-V characteristics instruments. The Atomic Force Microscope (AFM) was used in order to characterize the surface imaging of copper oxide films and the thicknesses were measured using a surface profiler. The AFM studies revealed that the roughness of the CuO films increased after annealing and this is due to the formation of large clusters of grains from the merging of small clusters grains. The CuO films thicknesses also become two times higher than the CuO films without annealing process.
机译:通过浸入技术研究了氟掺杂氧化锡(FTO)涂覆玻璃上氟掺杂氧化锡(FTO)涂覆玻璃的合成和表征。此外,已经使用ZnO层以改善CuO膜的吸收光谱。通过现场发射扫描电子显微镜(FESEM),X射线衍射仪(XRD),UV-Vis光谱(吸光度)和I-V特性器械对形态学,结构,光学和电铜膜进行分析。使用原子力显微镜(AFM)以表征氧化铜膜的表面成像,并且使用表面分析仪测量厚度。 AFM的研究表明,退火后CUO膜的粗糙度增加,这是由于从小簇颗粒的合并形成大块谷物。 CuO膜厚度也比没有退火工艺的CuO膜高两倍。

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