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Analytical Estimate for Curing-Induced Stress and Warpage in Coating Layers

机译:涂层中诱导产生的应力和翘曲的分析估计

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摘要

A thermoset coating that is applied to an elastic substrate will develop residual stresses during curing because of polymerization shrinkage of the resin. This shrinkage only partly contributes to the residual stresses because, before gelation, the stresses relax completely. In this study, we developed explicit analytical expressions for the curing efficiency factor, the residual stresses, and the resulting warpage. We did this by assuming that after gelation, the material was in its rubbery state and that viscoelastic effects were absent. A difference between the free and constrained warpages during curing was made. The analytical warpage models were shown to give results comparable to those of the numer-ical calculations with a fully curing-dependent viscoelastic material model. Furthermore, for the first time, accurate analytical expressions for the stress-free temperature and stress-free strain were obtained. With these expressions, the effect of curing shrinkage on the residual stresses could easily be incorporated into existing (numerical) stress analysis without the need for extensive curing-dependent viscoelastic material models.
机译:由于树脂的聚合收缩,应用于弹性基材的热固性涂料将在固化过程中产生残余应力。该收缩仅部分地导致残余应力,因为在胶凝之前,应力完全松弛。在这项研究中,我们为固化效率因子,残余应力和产生的翘曲开发了明确的分析表达式。我们通过假设胶凝后该材料处于橡胶态并且不存在粘弹性效应来进行此操作。固化期间的自由翘曲和约束翘曲之间存在差异。分析翘曲模型显示出与完全依赖于固化的粘弹性材料模型的数值计算结果相当的结果。此外,首次获得了无应力温度和无应力应变的精确解析表达式。利用这些表达式,可以轻松地将固化收缩对残余应力的影响并入现有(数值)应力分析中,而无需广泛的依赖于固化的粘弹性材料模型。

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