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首页> 外文期刊>Surface & Coatings Technology >Process-structure-property relations of micron thick Gd _2O _3 films deposited by reactive electron-beam physical vapor deposition (EB-PVD)
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Process-structure-property relations of micron thick Gd _2O _3 films deposited by reactive electron-beam physical vapor deposition (EB-PVD)

机译:通过反应电子束物理气相沉积(EB-PVD)沉积的微米级Gd _2O _3微米厚膜的工艺-结构-性能关系

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摘要

Thick polycrystalline gadolinium oxide (Gd _2O _3) films up to 11μm in thickness were deposited via reactive electron beam-physical vapor deposition (EB-PVD) on silicon (111) substrates for use in neutron radiation detection. The effects of coating thickness, substrate temperature, and oxygen flow on film structural, electrical and optical properties were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM), transmission electron microscopy (TEM), capacitance-voltage (C-V) measurements, and ultraviolet-visible (UV-Vis) spectroscopy. Films were characterized as either monoclinic or mixed monoclinic and cubic phase depending on deposition parameters. Increasing the deposition temperature resulted in increased film crystallinity and cubic phase volume while decreasing the O _2 flow rate resulted in increased volume of the monoclinic phase. Evidence of a thickness dependent crystallography is also presented. Electrical property measurements showed thin film dielectric constant could be tailored between 12 and 20 at 1MHz frequency by decreasing the oxygen flow rate at deposition temperatures of 250°C which is attributed to an increased presence of the monoclinic phase and increased film density. Band gap values were calculated from transmission measurements and ranged between 5.44 and 5.96eV.
机译:通过反应电子束物理气相沉积(EB-PVD)在硅(111)衬底上沉积厚达11μm的厚多晶氧化g(Gd _2O _3)薄膜,用于中子辐射检测。通过X射线衍射(XRD),扫描电子显微镜(SEM),原子力显微镜(AFM),透射电子显微镜(TEM)研究了涂层厚度,基材温度和氧气流量对薄膜结构,电学和光学性能的影响),电容电压(CV)测量和紫外可见光谱(UV-Vis)。取决于沉积参数,将薄膜表征为单斜相或混合的单斜相和立方相。升高沉积温度导致膜结晶度和立方相体积增加,而降低O _2流速导致单斜相体积增加。还提供了厚度依赖性晶体学的证据。电性能测量表明,通过降低沉积温度为250°C时的氧气流速,可以在1MHz频率下将薄膜介电常数调整为12至20之间,这归因于单斜晶相的存在增加和膜密度的增加。根据传输测量值计算带隙值,范围在5.44和5.96eV之间。

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