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Bias dependence of ionizing radiation damage in SiGe HBTs at different dose rates

机译:不同剂量率下SiGe HBT中电离辐射损伤的偏倚

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摘要

The influences of three different bias conditions on the ionizing radiation damage at different dose rates were investigated in discrete silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs). Experiment results demonstrated that the bias configuration corresponding to the worst performance degradation depended on the dose rate. For the high dose rate irradiation, the case with all terminals floating shown an enhanced degradation, while during the low dose rate irradiation, the forward active mode suffered more irradiation damage. The underlying physical mechanisms were analyzed and investigated in detail. It was indicated that the varied bias dependences for the high and low dose rate irradiation might be attributed to different origins of hole and proton induced by gamma irradiation.
机译:在分立的硅锗(SiGe)异质结双极晶体管(HBT)中,研究了三种不同偏压条件对不同剂量率下电离辐射损伤的影响。实验结果表明,与最坏的性能下降相对应的偏置配置取决于剂量率。对于高剂量率辐照,所有端子都悬空的情况显示出增强的劣化,而在低剂量率辐照期间,前向主动模式遭受的辐照损害更大。对潜在的物理机制进行了详细分析和调查。结果表明,高剂量率和低剂量率辐射的不同偏差依赖性可能归因于伽马射线诱导的空穴和质子的不同起源。

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