Inkjet patterning of multiline intersections for wirings in printed electronics

摘要

Inkjet printed electronics using thermo-curable liquid inks exhibit particular geometrical characteristics in terms of regularity. This article presents a morphological analysis for inkjet printed multi line intersections that are critical structures for building circuits. We studied thin-film structures of silver conductive ink and printed by inkjet technology. Instability of the ink during printing causes the thickness irregularity of vertex, normally with peaks at these areas. We propose the usage of specific patterns for intersections as thickness regularity compensations. The results show that some patterns help to reduce this instability and improve the thickness regularity of intersections morphology.