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Erbium emission in MOS light emitting devices: From energy transfer to direct impact excitation

机译:MOS发光器件中的emission发射:从能量转移到直接冲击激发

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摘要

The electroluminescence (EL) at 1.54νm of metaloxidesemiconductor (MOS) devices with Er ~(3+) ions embedded in the silicon-rich silicon oxide (SRSO) layer has been investigated under different polarization conditions and compared with that of erbium doped SiO _2 layers. EL time-resolved measurements allowed us to distinguish between two different excitation mechanisms responsible for the Er ~(3+) emission under an alternate pulsed voltage signal (APV). Energy transfer from silicon nanoclusters (Si-ncs) to Er ~(3+) is clearly observed at low-field APV excitation. We demonstrate that sequential electron and hole injection at the edges of the pulses creates excited states in Si-ncs which upon recombination transfer their energy to Er ~(3+) ions. On the contrary, direct impact excitation of Er ~(3+) by hot injected carriers starts at the FowlerNordheim injection threshold (above 5MVcm ~1) and dominates for high-field APV excitation.
机译:研究了在不同极化条件下,将Er〜(3+)离子嵌入富硅氧化硅(SRSO)层中的金属氧化物半导体(MOS)器件在1.54μm处的电致发光(EL),并将其与掺doSiO _2层。 EL时间分辨的测量值使我们能够区分在交替脉冲电压信号(APV)下负责Er〜(3+)发射的两种不同的激励机制。在低场APV激发下,清楚地观察到了从硅纳米团(Si-ncs)到Er〜(3+)的能量转移。我们证明了在脉冲边缘的顺序电子和空穴注入在Si-ncs中产生激发态,该激发态在复合时将其能量转移到Er〜(3+)离子上。相反,热注入的载流子对Er〜(3+)的直接冲击激发始于FowlerNordheim注入阈值(高于5MVcm〜1),并在高场APV激发中占主导地位。

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