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Electrical-contact-free readout of the response of superconductive bolometer arrays using thermal cross talk

机译:使用热串扰无电地读取超导辐射热计阵列的响应

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We utilized and investigated the unique dependence of the magnitude and phase of the response on thermal cross talk between bolometer pixels in an array to measure the response of the devices through fewer monitoring devices. We show the feasibility of the proposed readout technique by use of two source pixels in an array, as the image-mapping devices, and one optically shielded pixel as the readout device. While the sensing pixels were electrical-contact free, the readout device was current biased in 4-probe current-bias configuration. Both the phase and the magnitude of the response due to the cross talk in the array were found to be strongly dependent on the modulation frequency and the distance between the sensing and the readout pixels. A series of measurements were designed to extract the response of each single-sensing pixel. By combining the measured data, the response of individual pixels could be extracted through the interpolation of the mapped responses.
机译:我们利用并研究了响应的幅度和相位对阵列中辐射热测量像素之间的热串扰的独特依赖性,以通过较少的监视设备来测量设备的响应。我们通过使用阵列中的两个源像素作为图像映射设备,以及使用一个光屏蔽像素作为读出设备,展示了提出的读出技术的可行性。当感测像素无电接触时,读出设备将电流偏置为4探针电流偏置配置。发现由于阵列中的串扰引起的响应的相位和幅度都强烈地取决于调制频率以及感测像素与读出像素之间的距离。设计了一系列测量以提取每个单感应像素的响应。通过组合测量数据,可以通过内插映射响应来提取单个像素的响应。

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