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首页> 外文期刊>CERAMICS INTERNATIONAL >Low temperature spark plasma densification of nano-SiC powder with novel Al2O3-Ho2O3 additives for SiC/SiC applications
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Low temperature spark plasma densification of nano-SiC powder with novel Al2O3-Ho2O3 additives for SiC/SiC applications

机译:用于SiC / SiC的新型Al2O3-Ho2O3添加剂对纳米SiC粉末的低温火花等离子体致密化

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摘要

In the current work, a novel liquid additive system consisting of Al2O3 and Ho2O3 was introduced to achieve spark plasma densification of nano-SiC powder at both low temperature (1700 degrees C) and moderate pressure (20 MPa). For the SiC sample sintered with 7.5 wt% additives, we obtained relative density of 98.6%, bending strength of (617 +/- 43) MPa, Vickers hardness of (23.2 +/- 0.3) GPa, and indentation toughness of (3.4 +/- 0.1) MPa m(1/2). (C) 2016 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
机译:在当前的工作中,引入了一种由Al2O3和Ho2O3组成的新型液体添加剂体系,以在低温(1700摄氏度)和中等压力(20 MPa)下实现纳米SiC粉末的火花等离子体致密化。对于烧结有7.5 wt%添加剂的SiC样品,我们获得了98.6%的相对密度,(617 +/- 43)MPa的弯曲强度,(23.2 +/- 0.3)GPa的维氏硬度和(3.4 + /-0.1)MPa m(1/2)。 (C)2016 Elsevier Ltd和Techna Group S.r.l.版权所有。

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