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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >High Transport Si/SiGe Heterostructures for CMOS Transistors with Orientation and Strain Enhanced Mobility
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High Transport Si/SiGe Heterostructures for CMOS Transistors with Orientation and Strain Enhanced Mobility

机译:具有方向性和应变增强迁移率的CMOS晶体管的高传输Si / SiGe异质结构

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We have demonstrated high mobility MOS transistors on high quality epitaxial SiGe films selectively grown on Si (100) substrates. The hole mobility enhancement afforded intrinsically by the SiGe channel (60%) is further increased by an optimized Si cap (40%) process, resulting in a combined ~100% enhancement over Si channels. Surface orientation, channel direction, and uniaxial strain technologies for SiGe channels CMOS further enhance transistor performances. On a (110) surface, the hole mobility of SiGe pMOS is greater on a (110) surface than on a (100) surface. Both electron and hole mobility on SiGe (110) surfaces are further enhanced in a <110> channel direction with appropriate uniaxial channel strain. We finally address low drive current issue of Ge-based nMOSFET. The poor electron transport property is primarily attributed to the intrinsically low density of state and high conductivity effective masses. Results are supported by interface trap density (D_(it)) and specific contact resistivity (ρ_c).
机译:我们已经证明了在Si(100)衬底上选择性生长的高质量外延SiGe膜上的高迁移率MOS晶体管。通过优化的Si盖层(40%)工艺,可以进一步提高SiGe沟道固有的空穴迁移率(60%),从而比Si沟道提高了约100%。 SiGe沟道CMOS的表面取向,沟道方向和单轴应变技术进一步增强了晶体管的性能。在(110)表面上,SiGe pMOS的空穴迁移率在(110)表面上大于在(100)表面上。 SiGe(110)表面上的电子和空穴迁移率都在<110>沟道方向上以适当的单轴沟道应变得到了进一步增强。我们终于解决了基于Ge的nMOSFET的低驱动电流问题。电子传输性能差主要归因于固有的低态密度和高电导有效质量。界面陷阱密度(D_(it))和比接触电阻率(ρ_c)支持结果。

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