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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >Evaluation of impurity depletion effect near n{sup}+poly-Si gate side wall/SiO{sub}2 interfaces for sub-100nm nMOSFETs
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Evaluation of impurity depletion effect near n{sup}+poly-Si gate side wall/SiO{sub}2 interfaces for sub-100nm nMOSFETs

机译:低于100nm nMOSFET的n {sup} + poly-Si栅极侧壁/ SiO {sub} 2界面附近的杂质耗尽效应评估

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摘要

2Oμm-3Onm gate length nMOSFETs with 1.6-1.86nm thick gate oxide have been fabricated, and the gate leakage current and the gate resistance have been studied systematically as a function of the gate length. It is found that, in the sub-O.5μm gate length region, the gate resistivity drastically increases with decreasing gate length. The result is interpreted in terms of the carrier depletion in poly-Si gate due to phosphorus pile-up at the gate poly-Si/SiO{sub}2 interface.
机译:制作了栅厚度为1.6-1.86nm的20μm-3Onm栅长nMOSFET,并系统研究了栅漏电流和栅电阻与栅长的关系。结果发现,在小于0.5μm的栅极长度区域,栅极电阻率随着栅极长度的减小而急剧增加。根据在栅极多晶硅/ SiO {sub} 2界面处磷堆积引起的多晶硅栅极中的载流子耗尽来解释该结果。

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