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Synchrotron radiation X-ray reflectivity measurements of CVD-silicon oxide film treated by radical oxidation

机译:自由基氧化处理的CVD-氧化硅膜的同步辐射X射线反射率测量

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摘要

The insulation characteristic of CVD silicon oxide films are inferior to that of thermal silicon oxide films. However, CVD silicon oxide films are able to grow at low temperature and on any under layers. On the other hand, radical oxidation is able to be treated at low temperature because the oxidizability of that is very strong. We studied the application of radical oxidation to CVD silicon oxide films to improve the insulation characteristic at low temperature. On the other hand, conventional X-ray reflectivity measurements could not obtain the density of ultra thin silicon oxide films because the intensity of X-ray flax is insufficient. We applied the synchrotron radiation X-ray reflectivity measurements to the CVD silicon oxide films treated by radical oxidation, and estimate the density and the surface roughness. It was clarified that density of CVD silicon oxide films increased as high as thermal oxide films and leak current decreased greatly by radical oxidation. The surface roughness did not decrease. Therefore increasing of density would decrease the leak current.
机译:CVD氧化硅膜的绝缘特性低于热氧化硅膜的绝缘特性。但是,CVD氧化硅膜能够在低温下以及任何底层上生长。另一方面,自由基氧化能够在低温下进行处理,因为其氧化能力非常强。我们研究了自由基氧化在CVD氧化硅膜中的应用,以改善低温下的绝缘特性。另一方面,常规的X射线反射率测量不能获得超薄氧化硅膜的密度,因为X射线亚麻的强度不足。我们将同步辐射X射线反射率测量结果应用于通过自由基氧化处理的CVD氧化硅膜,并估计了密度和表面粗糙度。可以肯定的是,CVD氧化硅膜的密度与热氧化膜一样高,并且泄漏电流由于自由基氧化而大大降低。表面粗糙度没有降低。因此,增加密度将减少泄漏电流。

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