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Microstructure and giant magnetoresistance of Ag-Co films fabricated by means of an extremely clean sputtering process (comparied with Cu-Co films)

机译:通过非常干净的溅射工艺(与Cu-Co膜相比)制造的Ag-Co膜的微观结构和巨大的磁阻

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摘要

The influence of impurities in the sputteringatmosphere on the microstructure and giant magnetoresistance(GMR) of Ag_(100-x)Co_x (x=0-62 at percent) thin films wasinvestigated. Ag-Co films were prepared on quartz substrates atroom temperature, varying the purity of the sputtering atmosphereby changing the base pressure, with 10~(-11) Torr for an extremelyclean process (XC-process) and 10~(-7) Torr for a lower-gradeprocess (LG-process). The correlation between the microstructureand the GMR of Ag-Co films after annealing is discussed. It wasfound that (1) the precipitation of Co particles progressed in theas-deposited films, and the degree of supersaturation of the matrixphase in the LG-processed films was higher than that in the XC-processed films; (2) the size of the Co particles precipitated in theas-deposited LG-processed films was larger than that in the XC-processed films, and resulted in a higher MR ratio of the as-deposited LG-processed films than that of the XC-processes onesunder a maximum applied field of 14 kOe; (3) the magnitude ofthe MR ratio in the XC-processes films after annealing above 300deg C was larger than that in the LG-processed ones, apparentlybecause of the homogeneity of the Co particles of the precipitate.
机译:研究了溅射气氛中杂质对Ag_(100-x)Co_x(x = 0-62 at%)薄膜的微观结构和巨磁阻(GMR)的影响。在室温下在石英基板上制备Ag-Co膜,通过改变基本压力来改变溅射气氛的纯度,对于极干净的工艺(XC工艺)使用10〜(-11)Torr,对于10C(-7)Torr使用10〜(-7)Torr。低级进程(LG进程)。讨论了退火后Ag-Co薄膜的微观结构与GMR的关系。结果发现:(1)沉积后的薄膜中Co颗粒的析出逐渐发生,LG加工薄膜中基体相的过饱和度高于XC加工薄膜中。 (2)在沉积的LG处理的膜中沉淀的Co颗粒的尺寸大于在XC处理的膜中沉积的Co颗粒的尺寸,并且导致沉积的LG处理的膜的MR比高于XC的MR比。 -在最大应用场强为14 kOe的条件下处理; (3)在300℃以上退火后,在XC处理的膜中的MR比的大小比在LG处理的膜中的MR比的大小大,这显然是由于沉淀物的Co颗粒的均质性。

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