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Copper Sheet with Excellent Adhesion Property to a Resin Layer by Plating with Blacked Chronium Compound Layer

机译:镀黑铬化合物层对树脂层的附着力优异的铜板

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摘要

Surface treatment of metallic sheet was developed with respect to a copper substrate and a blacked chromium compound layer, wherein the treated surface of the chromium compound layer is covered with fine, upright, scaly protrusions.The developed copper sheet kept excellent adhesion strength to a resin layer even after high temperature treatment or high moisture treatment, which was considered to be come from an anchor effect of said layer structure.A blacked chromium compound layer showed high resistance to the salt spray test and it also showed excellent adhesion stability with substrate in deep drawing or bending deformation. The above characteristic of blacked chromium compound layer was considered to be come from thin thickness of amorphous layer, wherein the elemental ratio of oxygen/chromium changes in moving out from the boundary between the substrate and the surface layer. The developed copper sheet has a possibility to be applied high performance electronic and electrical components.
机译:针对铜基板和涂黑的铬化合物层进行了金属板的表面处理,其中铬化合物层的处理表面覆盖有细小,直立的鳞状突起。即使经过高温处理或高湿处理后的镀层,也被认为是由于所述层结构的锚固效应。涂黑的铬化合物层表现出较高的耐盐雾试验性,并且在深层中还具有与基材的优异粘合稳定性绘图或弯曲变形。认为变黑的铬化合物层的上述特征是由于非晶层的厚度薄,其中氧/铬的元素比在从基板和表面层之间的边界移出时发生变化。研制出的铜板有可能被应用于高性能的电子和电气元件。

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