Application of flip chip bonding technology to mobile communication terminals

摘要

In the field of mobile communication systems, terminals have been rapidly downsized and given higher functions. This has led to demand for high-density surface mounting technology. For this reason, flip chip bonding (FCB) technology has beenestablished in which the LSI chip is directly bonded to the printed wiring board (PWB).This is currently the ultimate high-density surface mounting technology, and has been applied to the mass production of LCD modules for pagers. It was developed usinganisotropic conductive film (ACF), gold ball bumps, and B{sup}2It{sub}TM (buried bump interconnection technology) substrate for fine-pitch patterns.