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Integrated color pixels in 0.18-μm complementary metal oxide semiconductor technology

机译:采用0.18μm互补金属氧化物半导体技术的集成彩色像素

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Following the trend of increased integration in complementary metal oxide semiconductor (CMOS) image sensors, we have explored the potential of implementing light filters by using patterned metal layers placed on top of each pixel's photodetector. To demonstrate wavelength selectivity, we designed and prototyped integrated color pixels in a standard 0.18-μm CMOS technology. Transmittance of several one-dimensional (1D) and two-dimensional (2D) patterned metal layers was measured under various illumination conditions and found to exhibit wavelength selectivity in the visible range. We performed (a) wave optics simulations to predict the spectral responsivity of an uncovered reference pixel and (b) numerical electromagnetic simulations with a 2D finite-difference time-domain method to predict transmittances through 1D patterned metal layers. We found good agreement in both cases. Finally, we used simulations to predict the transmittance for more elaborate designs.
机译:随着互补金属氧化物半导体(CMOS)图像传感器中集成度增加的趋势,我们已经探索了通过使用放置在每个像素光电探测器顶部的图案化金属层来实现滤光器的潜力。为了证明波长选择性,我们使用标准的0.18μmCMOS技术设计并原型化了集成彩色像素。在各种照明条件下测量几个一维(1D)和二维(2D)图案化金属层的透射率,发现在可见光范围内显示出波长选择性。我们执行了(a)波动光学模拟以预测未覆盖参考像素的光谱响应,以及(b)使用2D有限差分时域方法进行数值电磁模拟以预测通过一维图案化金属层的透射率。在这两种情况下,我们都达成了一致。最后,我们使用仿真来预测更精细设计的透射率。

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