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首页> 外文期刊>Journal of the Korean Physical Society >A study on the properties of C-doped Ge8Sb2Te11 thin films during an amorphous-to-crystalline phase transition
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A study on the properties of C-doped Ge8Sb2Te11 thin films during an amorphous-to-crystalline phase transition

机译:掺C的Ge8Sb2Te11薄膜在非晶-晶体相变过程中的性能研究

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摘要

In this work, we evaluated the structural, electrical and optical properties of carbon-doped Ge8Sb2Te11 thin films. In a previous work, GeSbTe alloys were doped with different materials in an attempt to improve the thermal stability. Ge8Sb2Te11 and carbon-doped Ge8Sb2Te11 films of 250 nm in thickness were deposited on p-type Si (100) and glass substrates by using a RF magnetron reactive co-sputtering system at room temperature. The fabricated films were annealed in a furnance in the 0 similar to 400A degrees C temperature range. The structural properties were analyzed by using X-ray diffraction (XRD), and the result showed that the carbon-doped Ge8Sb2Te11 had a face-centeredcubic (fcc) crystalline structure and an increased crystallization temperature (T (c) ). An increase in the T (c) leads to thermal stability in the amorphous state. The optical properties were analyzed by using an UV-Vis-IR spectrophotometer, and the result showed an increase in the optical-energy band gap (E (op) ) in the crystalline materials and an increase in the E (op) difference (Delta E (op) ), which is a good effect for reducing the noise in the memory device. The electrical properties were analyzed by using a 4-point probe, which showed an increase in the sheet resistance (R (s) ) in the amorphous state and the crystalline state, which means a reduced programming current in the memory device.
机译:在这项工作中,我们评估了掺碳的Ge8Sb2Te11薄膜的结构,电学和光学性质。在以前的工作中,GeSbTe合金用不同的材料掺杂,以试图提高热稳定性。通过在室温下使用射频磁控反应共溅射系统,在p型Si(100)和玻璃基板上沉积厚度为250 nm的Ge8Sb2Te11和碳掺杂的Ge8Sb2Te11膜。所制得的薄膜在类似于400A摄氏度温度范围的0炉中进行退火。使用X射线衍射(XRD)分析了结构性能,结果表明,掺碳的Ge8Sb2Te11具有面心立方(fcc)晶体结构和升高的结晶温度(T(c))。 T(c)的增加导致非晶态的热稳定性。通过使用UV-Vis-IR分光光度计分析光学性质,结果表明结晶材料中的光能带隙(E(op))增加并且E(op)差(Δ)增加E(op)),这对于减少存储设备中的噪声有很好的效果。通过使用四点探针分析电性能,该探针显示出在非晶态和结晶态下的薄层电阻(R(s))增加,这意味着存储器件中的编程电流减小。

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