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首页> 外文期刊>Journal of the European Ceramic Society >Low sintering BaNd_2Ti_4O_(12) microwave ceramics prepared by CuO thin layer coated powder
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Low sintering BaNd_2Ti_4O_(12) microwave ceramics prepared by CuO thin layer coated powder

机译:CuO薄层包覆粉末制备的低烧结BaNd_2Ti_4O_(12)微波陶瓷

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摘要

Recently, BaO-Nd_2O_3-TiO_2 systems are widely studied for microwave applications because of their high dielectric constant and high quality factor. However, pure BaNd_2Ti_4O_(12) ceramics without additives have to be sintered above 1300 deg C to achieve densification. Copper oxide has been known as a good sintering aid for electronic ceramics and less reactive toward silver. We have introduced the CuO into BaNd_2Ti_4O_(12) by modifying the surface of BaNd_2Ti_4O_(12) by CuO thin layer on the calcined powder instead of mixing CuO directly with BaNd_2Ti_4O_(12) powder. The process reduces the amount of sintering aid and minimized the negative impact of sintering aid on dielectric properties such as quality factor. The CuO precursor solution of Cu(CH_3COO)_2, Cu(NO_3)_2 and CuSO_4, were used to prepare CuO thin layer. They were investigated individually to determine their effects on the densification, crystalline structure, microstructure and microwave dielectric properties of BaNd_2Ti_4O_(12). The CuSO_4 coated BaNd_2Ti_4O_(12) sintered at 1150 deg C has exhibited better dielectric properties than those of CuO doped BaNd_2Ti_4O_(12) (k, 62.5 versus 61.2; Q X f, 11,500 GHz versus 10,500 GHz). The thin layer dopant coating process has been found to be a very effective way to lower ceramic sintering temperature without scarifying its dielectric properties.
机译:近年来,由于BaO-Nd_2O_3-TiO_2体系具有较高的介电常数和高品质因数,因此被广泛用于微波领域。但是,无添加剂的纯BaNd_2Ti_4O_(12)陶瓷必须在1300℃以上烧结才能致密化。众所周知,氧化铜是电子陶瓷的良好烧结助剂,对银的反应性较低。我们通过在煅烧粉末上用CuO薄层修饰BaNd_2Ti_4O_(12)的表面,而不是将CuO与BaNd_2Ti_4O_(12)粉末直接混合,将CuO引入BaNd_2Ti_4O_(12)。该方法减少了烧结助剂的量并使烧结助剂对介电性能例如品质因数的负面影响最小化。用Cu(CH_3COO)_2,Cu(NO_3)_2和CuSO_4的CuO前驱体溶液制备CuO薄层。分别进行了研究,以确定它们对BaNd_2Ti_4O_(12)的致密化,晶体结构,微结构和微波介电性能的影响。在1150摄氏度下烧结的CuSO_4涂层的BaNd_2Ti_4O_(12)表现出比CuO掺杂的BaNd_2Ti_4O_(12)更好的介电性能(k,62.5 vs 61.2; Q X f,11,500 GHz vs 10,500 GHz)。已发现薄层掺杂剂涂覆工艺是降低陶瓷烧结温度而不损害其介电性能的非常有效的方法。

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