首页> 外文期刊>Journal of the European Ceramic Society >Low temperature firing of BiSbO_4 microwave dielectric ceramic with B_2O_3-CuO addition
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Low temperature firing of BiSbO_4 microwave dielectric ceramic with B_2O_3-CuO addition

机译:添加B_2O_3-CuO的BiSbO_4微波介电陶瓷的低温烧成。

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摘要

The influence of B_2O_3-Cu0 addition on the sintering behavior, phase composition, microstructure and microwave dielectric properties of BiSbO_4 ceramic have been investigated. The BiSbO_4 ceramics can be well densified to approach above 95 percent theoretical density in the sintering temperature range from 840 to 960 DEG C as the addition amount of B_2O_3-Cu0 increases from 0.6 to 1.2 wt. percent . Sintered ceramic samples were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The microwave permittivity epsilon_r saturated at 19-20 and Qf values varied between 33,000 and 46,000 GHz while temperature coefficient of resonant frequency shifting between -70 and -60 ppm/ deg C at sintering temperature around 930 DEG C. Lowering sintering temperature of BiSbo_4 ceramics makes it possible for application in low temperature co-fired ceramic technology.
机译:研究了B_2O_3-Cu0的添加对BiSbO_4陶瓷烧结行为,相组成,微观结构和微波介电性能的影响。随着B_2O_3-Cu0的添加量从0.6到1.2 wt。%,在840至960℃的烧结温度范围内,BiSbO_4陶瓷可以很好地致密,达到理论密度的95%以上。百分 。通过X射线衍射(XRD)和扫描电子显微镜(SEM)对烧结的陶瓷样品进行表征。微波介电常数epsilon_r饱和在19-20,Qf值在33,000和46,000 GHz之间变化,而谐振频率的温度系数在930℃左右的烧结温度下在-70到-60 ppm /℃之间变化。降低BiSbo_4陶瓷的烧结温度可有可能应用于低温共烧陶瓷技术。

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