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X-Ray Characterization of Resistor/Dielectric Material for Low Temperature Co-211 Fired Ceramic Packages

机译：用于低温Co-211烧制陶瓷封装的电阻器/介电材料的X射线表征

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High temperature XRD has been employed to monitor the devitrification of Dupont211u001e951 low temperature co-fired ceramic (LTCC) and Dupont E84005 resistor Mc. The 211u001eLTCC underwent devitrification to an anorthite phase in the range of 835-875C 211u001ewith activation energy of 180 kJ/mol as calculated from kinetic data. The

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作者
Dimos; Kotula; Rodriguez; Yang;
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年度 1999
页码 1-8
总页数 8
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Packaging; Ceramic materials; Resistors; High temperature tests;

机译：包装;陶瓷材料;电阻器;高温测试;

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专利

1. Thick-film resistor/dielectric interactions in a low temperatureco-fired ceramic package [J] . Sutterlin R.C., Dayton G.O., Biggers J.V. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1995,第2期

机译：低温共烧陶瓷封装中的厚膜电阻/介电相互作用
2. Thick-film resistor/dielectric interactions in a low temperatureco-fired ceramic package [J] . Sutterlin R.C., Dayton G.O., Biggers J.V. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1995,第2期

机译：低温共烧陶瓷封装中的厚膜电阻/介电相互作用
3. Thick-film resistor/dielectric interactions in a low temperature co-fired ceramic package [J] . Sutterlin R.C., Dayton G.O. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1995,第2期

机译：低温共烧陶瓷封装中的厚膜电阻/介电相互作用
4. Full-Wave Electromagnetic Characterization and Measurement of Wirebond Transitions on High Temperature Co-fired Ceramics (HTCC) and Low Temperature Co-fired Ceramic (LTCC) Substrates For Broadband Package Designs [C] . Jerry Aguirre, Marcos Vargas, Jason Bast, 42nd international symposium on microelectronics (IMAPS 2009) . 2009

机译：宽带封装设计的高温共烧陶瓷（HTCC）和低温共烧陶瓷（LTCC）基板上的全波电磁特性和引线键合跃迁的测量
5. Buried resistor components in low temperature cofired ceramic packages. [D] . Fleischner, Paul Stuart. 1991

机译：低温共烧陶瓷封装中的埋入电阻器组件。
6. Effect of Ca–Al–Si–O common glass on dielectric properties of low-temperature co-fired ceramic materials with different fillers [O] . Zee-hoon Park, Dong-hun Yeo, Hyo-soon Shin -1

机译：Ca–Al–Si–O普通玻璃对含不同填料的低温共烧陶瓷材料介电性能的影响
7. Effect of Ca–Al–Si–O common glass on dielectric properties of low-temperature co-fired ceramic materials with different fillers [O] . Zee-hoon Park, Dong-hun Yeo, Hyo-soon Shin 2014

机译：Ca-Al-Si-O常见玻璃对不同填料的低温共烧陶瓷材料介电性能的影响

X-Ray Characterization of Resistor/Dielectric Material for Low Temperature Co-211 Fired Ceramic Packages

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