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Static characteristics and short channel effect in enhancement-mode AlN/GaN/AlN N-polar MISFET with self-aligned source/drain regions

机译:具有自对准源/漏区的增强模式AlN / GaN / AlN N极MISFET中的静态特性和短沟道效应

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This paper aims to simulate the I -V static characteristic of the enhancement-mode (E-mode) Npolar GaN metal-insulator-semiconductor field effect transistor (MISFET) with self-aligned source/drain regions. Firstly, with SILVACO TCAD device simulation, the drain-source current as a function of the gate-source voltage is calculated and the dependence of the drain-source current on the drain-source voltage in the case of different gate-source voltages for the device with a 0.62 μm gate length is investigated. Secondly, a comparison is made with the experimental report. Lastly, the transfer characteristic with different gate lengths and different buffer layers has been performed. The results show that the simulation is in accord with the experiment at the gate length of 0.62 μm and the short channel effect becomes pronounced as gate length decreases. The E-mode will not be held below a 100 nm gate length unless both transversal scaling and vertical scaling are being carried out simultaneously.
机译:本文旨在模拟具有自对准源/漏区的增强型(E-模式)Npolar GaN金属-绝缘体-半导体场效应晶体管(MISFET)的I -V静态特性。首先,通过SILVACO TCAD器件仿真,计算出漏极-源极电流与栅极-源极电压的关系,并且在不同栅极-源极电压的情况下,漏极-源极电流对漏极-源极电压的依赖性研究了栅极长度为0.62μm的器件。其次,与实验报告进行了比较。最后,已经执行了具有不同栅极长度和不同缓冲层的传输特性。结果表明,在栅极长度为0.62μm时,仿真结果与实验吻合,随着栅极长度的减小,短沟道效应更加明显。除非同时执行横向缩放和垂直缩放,否则E模式不会保持在100 nm的栅极长度以下。

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