An on-chip temperature compensation circuit for an InGaP/GaAs HBT RF power amplifier

摘要

A new on-chip temperature compensation circuit for a GaAs-based HBT RF amplifier applied to wire-less communication is presented. The simple compensation circuit is composed of one GaAs HBT and five resistors with various values, which allow the power amplifier to achieve better thermal characteristics with a little degra-dation in performance. It effectively compensates for the temperature variation of the gain and the output power of the power amplifier by regulating the base quiescent bias current. The temperature compensation circuit is applied to a 3-stage integrated power amplifier for wireless communication applications, which results in an improvement in the gain variation from 4.0 to 1.1 dB in the temperature range between –20 and +80℃.