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首页> 外文期刊>Journal of Semiconductors >A novel oxidation-based wet etching method for AlGaN/GaN heterostructures
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A novel oxidation-based wet etching method for AlGaN/GaN heterostructures

机译:一种新的基于氧化的AlGaN / GaN异质结构湿法刻蚀方法

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摘要

A novel wet etching method for AlGaN/GaN heterojunction structures is proposed using thermal oxidation followed by wet etching in KOH solution. It is found that an AlGaN/GaN heterostructure after high temperature oxidation above 700°C could be etched off in a homothermal (70°C) KOH solution while the KOH solution had no etching effects on the region of the AlGaN/GaN heterostructure protected by a SiO_2 layer during the oxidation process. A groove structure with 150 nm step depth on an AlGaN/GaN heterostructure was formed after 8 h thermal oxidation at 900°C followed by 30 min treatment in 70°C KOH solution. As the oxidation time increases, the etching depth approaches saturation and the roughness of the etched surface becomes much better. The physical mechanism of this phenomenon is also discussed.
机译:提出了一种新的AlGaN / GaN异质结结构的湿法刻蚀方法,该方法采用热氧化,然后在KOH溶液中进行湿法刻蚀。发现在高温(70°C)的KOH溶液中可以蚀刻掉700°C以上高温氧化后的AlGaN / GaN异质结构,而KOH溶液对受Al保护的AlGaN / GaN异质结构区域没有蚀刻作用在氧化过程中形成SiO_2层。在900°C下热氧化8小时后,在70°C KOH溶液中处理30分钟后,在AlGaN / GaN异质结构上形成了步长为150 nm的沟槽结构。随着氧化时间的增加,蚀刻深度接近饱和并且蚀刻表面的粗糙度变得更好。还讨论了这种现象的物理机制。

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