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A susceptor with a Λ-shaped slot in a vertical MOCVD reactor by induction heating

机译:通过感应加热在垂直MOCVD反应器中具有Λ形槽的基座

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By using the numerical simulation for the temperature field in the metal organic vapor deposition (MOCVD) reactor by induction heating, it is found that the temperature distribution in the conventional cylindershaped susceptor is nonuniform due to the skin effect of the induced current, which makes the temperature distribution of the wafer nonuniform. Therefore, a novel susceptor with a Λ-shaped slot is proposed. This slot changes the mode and the rate of the heat transfer in the susceptor, which improves the uniformity of the temperature distribution in the wafer. By using the finite element method (FEM), the susceptor with this structure for heating a wafer of four inches in diameter is optimized. It is observed that the optimized susceptor with the Λ-shaped slot makes the uniformity of the temperature distribution in the wafer improve by more than 85%, and a good uniformity of temperature distributions is kept under different wafer temperatures, which may be beneficial to the film growth.
机译:通过利用感应加热对金属有机气相沉积(MOCVD)反应器中的温度场进行数值模拟,发现常规圆筒形基座中的温度分布由于感应电流的趋肤效应而变得不均匀,这使得晶片温度分布不均匀。因此,提出了一种具有Λ形槽的新型基座。该槽改变了基座中传热的方式和速率,从而提高了晶片中温度分布的均匀性。通过使用有限元方法(FEM),具有用于加热直径为4英寸的晶片的这种结构的基座得到了优化。可以看出,带有Λ形槽的优化基座使晶片温度分布的均匀性提高了85%以上,并且在不同晶片温度下保持了良好的温度分布均匀性,这可能对电影成长。

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