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首页> 外文期刊>Journal of Semiconductors >A novel high-voltage device structure with an N~+ ring in substrate and the breakdown voltage model
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A novel high-voltage device structure with an N~+ ring in substrate and the breakdown voltage model

机译:衬底上具有N〜+环的新型高压器件结构和击穿电压模型

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摘要

A novel high-voltage device structure with a floating heavily doped NC ring embedded in the substrate is reported, which is called FR LDMOS. When the N~+ ring is introduced in the device substrate, the electric field peak of the main junction is reduced due to the transfer of the voltage from the main junction to the N~+ ring junction, and the vertical breakdown characteristic is improved significantly. Based on the Poisson equation of cylindrical coordinates, a breakdown voltage model is developed. The numerical results indicate that the breakdown voltage of the proposed device is increased by 56% in comparison to conventional LDMOS.
机译:报告了一种新颖的高压器件结构,该结构在衬底中嵌入了浮动的重掺杂NC环,称为FR LDMOS。当在器件衬底中引入N〜+环时,由于电压从主结转移到N〜+环结,主结的电场峰值减小,并且垂直击穿特性得到显着改善。基于圆柱坐标的泊松方程,建立了击穿电压模型。数值结果表明,与传统的LDMOS相比,该器件的击穿电压提高了56%。

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