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The behaviors of a stabilizer in an NITD system with electroless nickel plating

机译:化学镀镍的NITD系统中稳定剂的行为

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A novel non-isothermal deposition (NITD) system is developed for electroless plating in this work. This developed system is capable of enhancing the bath deposition rate and stability simultaneously. Although the deposition rate is in opposition to bath stability in a traditional EN system, this conflict is resolved by the developed NITD system. In this study, the effect of the stabilizer on the performance of the NITD electroless nickel (EN) system is investigated, and a mechanism is proposed to explain the outstanding characteristics of the NITD system such that bath stability remains unchanged as the deposition rate increases in the absence of a stabilizer. Bath stability is determined through observation of the precipitate using both laser light scattering and naked eye. [References: 18]
机译:在这项工作中,开发了一种用于化学镀的新型非等温沉积(NITD)系统。该开发的系统能够同时提高镀液沉积速率和稳定性。尽管在传统的EN系统中沉积速率与镀液稳定性相反,但已开发的NITD系统解决了这一冲突。在这项研究中,研究了稳定剂对NITD化学镍(EN)系统性能的影响,并提出了一种机制来解释NITD系统的突出特性,即随着沉积速率的增加,镀液稳定性保持不变。没有稳定剂。通过使用激光散射和肉眼观察沉淀物来确定镀液稳定性。 [参考:18]

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