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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Temperature stability of c-axis oriented LiNbO3/SiO2/Si thin film layered structures
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Temperature stability of c-axis oriented LiNbO3/SiO2/Si thin film layered structures

机译:c轴取向LiNbO3 / SiO2 / Si薄膜层状结构的温度稳定性

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Theoretical calculations have been performed for the temperature stability of the c-axis oriented LiNbO3 thin film layered structures on passivated silicon (SiO2/Si) substrate with and without a non-piezoelectric SiO2 overlayer. The phase velocity, electromechanical coupling coefficient and temperature coefficient of delay (TCD) have been calculated. The thicknesses of various layers have been determined for optimum SAW performance with zero TCD. The presence of a non-piezoelectric SiO2 overlayer on LiNbO3 film is found to significantly enhance the coupling coefficient. The optimized results reveal that a high coupling coefficient of K-2 = 3.45% and a zero TCD can be obtained in the SiO2/LiNbO3/SiO2/Si structure with a 0.235 lambda thick LiNbO3 layer sandwiched between 0.1 lambda thick SiO2 layers. [References: 25]
机译:对于具有和不具有非压电SiO2覆盖层的钝化硅(SiO2 / Si)衬底上的c轴取向LiNbO3薄膜层状结构的温度稳定性,已经进行了理论计算。计算了相速度,机电耦合系数和温度延迟系数(TCD)。已经确定了各层的厚度,以便在零TCD时获得最佳的SAW性能。发现在LiNbO3膜上存在非压电SiO2覆盖层可显着提高耦合系数。优化结果表明,在0.22 /λN的LiNbO3层夹在0.1λ/ SiO2层之间的SiO2 / LiNbO3 / SiO2 / Si结构中,可以获得高的K-2 = 3.45%的耦合系数和零TCD。 [参考:25]

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