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Laser deposition of semiconductor thin films based on iron oxides

机译:激光沉积基于铁氧化物的半导体薄膜

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Narrow band gap iron oxide semiconductor films were grown with the laser chemical vapour deposition (LCVD) and reactive pulsed laser deposition (RPLD) techniques. For LCVD, 10 and 18 nm thick films, with composition Fe2O3-x ( 0 <= x <= 1), were deposited from iron carbonyl vapours with an Ar+ laser. Their band gap (E-g) results were of 0.46 eV and 0.66 eV, respectively. For RPLD, an iron target was ablated in low pressure oxygen atmosphere ( 0.1-1 Pa) by a KrF excimer laser. A number of pulses ( 4000-8500) increasing with oxygen ambient pressure was used for each deposition. The film thickness increased with pulse number from 100 to 240 nm. E-g increased in the range 0.13-0.34 eV with increasing oxygen pressure during deposition. It is shown that both LCVD and RPLD are appropriate technologies for the deposition of narrow variable band gap iron oxide semiconductor thin films.
机译:窄带隙氧化铁半导体膜通过激光化学气相沉积(LCVD)和反应性脉冲激光沉积(RPLD)技术生长。对于LCVD,用Ar +激光从羰基铁蒸气中沉积10到18 nm厚的膜,组成为Fe2O3-x(0 <= x <= 1)。其带隙(E-g)结果分别为0.46 eV和0.66 eV。对于RPLD,用KrF准分子激光在低压氧气气氛(0.1-1 Pa)中烧蚀铁靶。每次沉积使用随氧气环境压力增加的多个脉冲(4000-8500)。膜厚随脉冲数从100到240 nm的增加而增加。随着沉积过程中氧气压力的增加,E-g在0.13-0.34 eV范围内增加。结果表明,LCVD和RPLD都是用于沉积窄可变带隙氧化铁半导体薄膜的合适技术。

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