Directed Self-assembly of Topcoat-free, Integration-friendly High-x Block Copolymers

摘要

To extend the scaling beyond the most widely used poly(styrene-b-methyl methacrylate) (PS-b-PMMA), organic high-x block copolymers (BCPs) were developed. Vertically oriented BCP domains were obtained by simple coat and bake process without application of an additional layer of a topcoat material. In addition, process-friendly conditions including low bake temperature (< 200 °C) and short bake time (≤ 5 min) provided a simple scheme to integrate these high-x block copolymers to standard lithography process and pre-patterns defined by 193i lithography. Successful demonstration of directed self-assembly of these high-x block copolymers on 193i-defmed guiding pre-patterns offers a simple route to access well-aligned perpendicular lamellae and cylinders with a pitch less than 20 nm.