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Development of Photosensitive Alicyclic Polyimides Based on Reaction Development Patterning

机译:基于反应展开图的光敏脂环族聚酰亚胺的开发

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摘要

Photosensitive polymers change their solubility into developer by photo-irradiation and form fine pattern by succeeding development, and thus they are important materials to prepare semiconductor integrated circuit [1, 2]. In use of photosensitive polymers for electronics packaging such as buffer coats and interlayer dielectrics, they remain in manufactures permanently, and therefore, they are required to have high thermal, mechanical and insulating properties. For such the applications, addition of photosensitivity to polyimides, known as representative high performance engineering plastics, has been investigated [3].
机译:光敏聚合物通过光辐照改变其在显影剂中的溶解度,并通过连续显影而形成精细的图案,因此,它们是制备半导体集成电路的重要材料[1、2]。在用于电子包装的光敏聚合物,例如缓冲涂层和层间电介质中,它们永久保留在制品中,因此,要求它们具有高的热,机械和绝缘性能。对于这样的应用,已经研究了将光敏性添加到聚酰亚胺中,这被称为代表性的高性能工程塑料[3]。

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