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Effects of irradiation induced Cu clustering on Vickers hardness and electrical resistivity of Fe–Cu model alloys

机译:辐照引起的Cu团簇对Fe–Cu模型合金的维氏硬度和电阻率的影响

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摘要

Three kinds of Fe-based model alloys, Fe–0.018 atomic percent (at.%) Cu, Fe–0.53at.%Cu, and Fe–1.06at.%Cu were irradiated with 2 MeV electrons up to the dose of 2 × 10~(-5) dpa at 250 ?C. After the irradiation, the increase in Vickers hardness and the decrease in electrical resistivity were observed. The increase in hardness by electron irradiation is proportional to the product of the Cu contents and the square root of the electron dose. The decrease in electrical resistivity is proportional to the product of the square of Cu contents and the electron dose. Cu clustering in the materials with electron irradiation and thermal aging was observed by means of the Atom Probe Tomography (APT). The change in Vickers hardness and electrical resistivity is well correlated with micro-structure evolution related to the Cu clustering process. The irradiation hardening was proportional to the square root of volume fraction of the Cu clusters from early stage of irradiation.
机译:用2个MeV电子辐照3种Fe基模型合金Fe–0.018原子百分数(at。%)Cu,Fe–0.53at。%Cu和Fe–1.06at。%Cu直至2× 250°C时10〜(-5)dpa。照射后,观察到维氏硬度的增加和电阻率的降低。电子辐射引起的硬度增加与Cu含量与电子剂量平方根的乘积成正比。电阻率的降低与Cu含量的平方与电子剂量的乘积成正比。利用原子探针层析成像(APT)观察到材料在电子辐照和热时效过程中的铜聚集。维氏硬度和电阻率的变化与与Cu团簇过程有关的微观结构的演变密切相关。从照射初期开始,照射硬化与Cu簇的体积分数的平方根成比例。

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