A study examining the influence of various design and process parameters on the solder joint thickness of 0805 components

摘要

This paper presents part of the results obtained after conducting an experiment designed with the help of the Design of Experiments (DoE) method. The aim of this experiment is to evaluate the dependencies between the layout design and the production quality of surface mount (SMT) boards. The DoE method was used to plan the variation of certain factors in order to see their influences on the responses. In this paper, we will focus on the interpretation of the results obtained after measuring the distance between the board surface and the bottom side of a chip component 0805.