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Structural properties and thermoelectric power of thermally evaporated InSbTe3 thin films

机译:热蒸发InSbTe3薄膜的结构性质和热电功率

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Stoichiometric thin films of different thickness (similar to 50 - 150 nm) of InSbTe3 were prepared by thermally evaporated Technique, onto pre-cleaned glass substrates at similar to 298 K The as deposited films were non-crystalline and the crystallinity was built on annealing at T >= 373 K. The analysis of X-ray data using a special computer program for unknown system confirmed that InSbTe3 compound has Orthorhombic structure with lattice constants a = 16.39 +/- 0.004 angstrom, b =10.21 +/- 0.0063 angstrom, c = 3.98 +/- 0.0019 angstrom, and cell volume,V = 666.64 +/- 0.0043 angstrom(3). Both dark electrical resistivity p, and thermoelectric power were measured in the temperature range (similar to 303-423K). Seebeck coefficient was found to be positive all over the temperature range, indicating that InSbTe3 films are p-type semiconducting material. Also, the variation of the mobility with the temperature has been estimated. The results interpreted according to the grain boundary potential barrier model and the present of small polaron with energy, W-P similar to 0.05 +/- 0.009 eV.
机译:通过热蒸发技术将不同厚度的InSbTe3(大约50-150 nm)的化学计量薄膜制备到大约298 K的预先清洁的玻璃基板上。 T> = 373K。使用特殊计算机程序对未知系统进行的X射线数据分析证实,InSbTe3化合物具有正交晶结构,晶格常数a = 16.39 +/- 0.004埃,b = 10.21 +/- 0.0063埃,c = 3.98 +/- 0.0019埃,细胞体积V = 666.64 +/- 0.0043埃(3)。在该温度范围内(类似于303-423K)测量了暗电阻率p和热电功率。发现塞贝克系数在整个温度范围内均为正值,表明InSbTe3薄膜是p型半导体材料。而且,已经估计了迁移率随温度的变化。根据晶界势垒模型和具有能量W-P的小极化子的存在解释了结果,W-P类似于0.05 +/- 0.009 eV。

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