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首页> 外文期刊>Journal of Micromechanics and Microengineering >Deep X-ray lithography processing for batch fabrication of thick polymer-based antenna structures
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Deep X-ray lithography processing for batch fabrication of thick polymer-based antenna structures

机译:用于批量制造基于聚合物的厚天线结构的深X射线光刻工艺

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摘要

Deep X-ray lithography is applied for the first time to fabricate polymer-based antenna structures with different portions of ceramic contents. To produce successful and viable antenna structures, three different methods are proposed using positive and negative tone resists. In the first method the structures are lithographically fabricated avoiding an intermediate molding step using SU-8 as a photosensitive resist filled with fine ceramic powder with particles in the submicron range. In the second and third methods a polymethylmethacrylate (PMMA) mold is first fabricated by X-ray lithography, and then SU-8/MMA mixed with the high ceramic powder content is injected into the mold. In these methods a final step of crosslinking for SU-8 and polymerization for MMA is also required. Optimized fabrication parameters allow the production of high quality antenna structures as thick as 2.3 mm. X-ray lithography capabilities in fabrication of antennas and other passive microwave components with special features reinforce the idea of fabricating integrated passive microwave circuits along with active circuits using this emerging technology.
机译:首次应用深X射线光刻技术来制造具有不同陶瓷含量的聚合物基天线结构。为了生产成功且可行的天线结构,提出了三种使用正负抗蚀剂的不同方法。在第一种方法中,对结构进行光刻加工,从而避免了使用SU-8作为光敏抗蚀剂的中间成型步骤,该步骤中填充了具有亚微米范围颗粒的精细陶瓷粉末。在第二和第三种方法中,首先通过X射线光刻技术制造聚甲基丙烯酸甲酯(PMMA)模具,然后将混合了高陶瓷粉末含量的SU-8 / MMA注入模具中。在这些方法中,还需要SU-8交联和MMA聚合的最后步骤。优化的制造参数可生产厚度高达2.3毫米的高质量天线结构。具有特殊功能的天线和其他无源微波组件的制造中的X射线光刻能力加强了使用这种新兴技术制造集成无源微波电路以及有源电路的想法。

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