On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points

摘要

Self-assembly has been widely accepted as the next generation technology for integrating highly dense microelectromechanical systems (MEMS), in particular for complex and hybrid systems composed of sensing, actuating, optical, electronic, mechanical and fluidic components. In addition, some micro components may have the same material, size, shape and binding affinity, but different functions. Ideally, each micro component should bind and can only bind to a designated binding site with no recognition error even for similar sites. Due to the spontaneous nature of 'self'-assembly, challenges remain in controlling this process. In this work, a relatively simple controllable, fluid-based self-assembly method has been demonstrated, which is able to integrate hybrid MEMS in a multi-batch-wise manner. The essence of this method is to pattern solders with different melting points to designated binding sites, and to activate them separately and sequentially, even individually if needed, with appropriate processing steps at adequate temperatures. Thus, self-assembly of MEMS micro components becomes programmable.