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Surface roughness, asperity contact and gold RFMEMS switch behavior

机译:表面粗糙度,粗糙接触和金RFMEMS开关性能

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摘要

Modeling predictions and experimental measurements were obtained to characterize the electro-mechanical response of radio frequency (RF) microelectromechanical (MEM) switches due to variations in surface roughness and finite asperity deformations. Three-dimensional surface roughness profiles were generated, based on a Weierstrass-Mandelbrot fractal representation, to match the measured roughness characteristics of contact bumps of manufactured RF MEMS switches. Contact asperity deformations due to applied contact pressures were then obtained by a creep constitutive formulation. The contact pressure is derived from the interrelated effects of roughness characteristics, material hardening and softening, temperature increases due to Joule heating and contact forces. This modeling framework was used to understand how contact resistance evolves due to changes in the real contact area, the number of asperities in contact, and the temperature and resistivity profiles at the contact points. The numerical predictions were qualitatively consistent with the experimental measurements and observations of how contact resistance evolves as a function of deformation time history. This study provides a framework that is based on integrated modeling and experimental measurements, which can be used in the design of reliable RF MEMS devices with extended life cycles.
机译:获得建模预测和实验测量结果,以表征由于表面粗糙度变化和有限的凹凸变形而引起的射频(RF)微机电(MEM)开关的机电响应。基于Weierstrass-Mandelbrot分形表示,生成了三维表面粗糙度轮廓,以匹配所制造的RF MEMS开关的接触凸点的测量粗糙度特征。然后通过蠕变本构公式获得由于施加的接触压力而引起的接触粗糙变形。接触压力源自粗糙度特性,材料硬化和软化,由于焦耳热和接触力引起的温度升高的相关影响。该建模框架用于了解由于实际接触面积,接触点的粗糙程度以及接触点处的温度和电阻率分布的变化而导致的接触电阻如何演变。数值预测在质量上与实验测量和观察到的接触电阻如何随变形时间历史变化而定性一致。这项研究提供了一个基于集成建模和实验测量的框架,可用于设计具有延长寿命周期的可靠RF MEMS器件。

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