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Microfabrication technologies for a coupled three-dimensional microelectrode, microfluidic array

机译:耦合三维微电极微流控阵列的微细加工技术

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摘要

Planar or two-dimensional (2D) microelectrode arrays (MEAs), which are used for in vitro culturing of neurons and tissue slices, have been in existence for over 30 years. However, in order to study complex network morphologies and tissue slices which contain substantial 3D neuronal structures, 3D MEAs with microfluidic ports are required. Integrated fabrication of 3D MEAs with embedded microfluidic ports for nutrient perfusion through these relatively thick tissues typically requires non-planar lithography, which is not easily accomplished. This paper reports a laser-scribing technique coupled with electroplating to fabricate 3D MEAs coupled with microfluidic ports. An excimer laser has been used to define patterns in a polymer mold layer that is conformally vapor-deposited on a 3D microfluidic SU-8 substrate. Metal is electroplated through this mold to fabricate electrodes at multiple heights. To demonstrate 3D MEAs, a standard design was chosen consisting of an array of three-dimensional protrusions ('towers') optionally with microfluidic functionality on which electrodes can be formed extending to the top of each tower. Additional electrodes are formed on the substrate resulting in a multi-level electrode structure. Since microfluidics can exist both in the substrate as well as along the towers, a coupled three-dimensional electrical and microfluidic functionality is achieved. The resulting 3D MEAs have been analyzed electrically using impedance spectroscopy and baseline noise measurements. They have further been evaluated fluidically using micro-particle image velocimetry measurements.
机译:用于体外培养神经元和组织切片的平面或二维(2D)微电极阵列(MEA)已经存在30多年了。但是,为了研究包含大量3D神经元结构的复杂网络形态和组织切片,需要具有微流体端口的3D MEA。具有嵌入式微流体端口以通过这些相对较厚的组织进行营养物灌注的3D MEA的集成制造通常需要非平面光刻,这不容易实现。本文报道了一种激光刻划技术,该技术与电镀相结合以制造与微流体端口相结合的3D MEA。准分子激光器已用于在聚合物模具层中定义图案,该模具层共形气相沉积在3D微流体SU-8基板上。通过该模具电镀金属,以制造多个高度的电极。为了演示3D MEA,选择了一个标准设计,其中包括三维突起(“塔”)阵列,这些突起可选地具有微流体功能,可以在其上形成延伸到每个塔顶部的电极。在基板上形成额外的电极,从而形成多层电极结构。由于微流体既可以存在于基底中也可以沿着塔存在,所以实现了耦合的三维电和微流体功能。已使用阻抗谱和基线噪声测量对生成的3D MEA进行了电分析。使用微粒图像测速仪对它们进行了流体评估。

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