...
首页> 外文期刊>Journal of Micromechanics and Microengineering >Thin-film piezoelectric bimorph actuators with increased thickness using double Pb[Zr,Ti]O-3 layers
【24h】

Thin-film piezoelectric bimorph actuators with increased thickness using double Pb[Zr,Ti]O-3 layers

机译:使用双层Pb [Zr,Ti] O-3层增加厚度的薄膜压电双压电晶片执行器

获取原文
获取原文并翻译 | 示例
           

摘要

We studied the effects of increasing the thickness of bimorph structures containing double layers of Pb(Zr,Ti)O-3 (PZT) thin films. Thick PZT films allow high-voltage application (e.g. in terms of coercive electric field and breakdown voltage) and large generative force, which are effective in microelectromechanical systems (MEMS) applications. Improvement of the deposition conditions and electrode structures facilitates the fabrication of the thin-film PZT/PZT bimorph structure. The PZT/PZT bimorph with a total thickness of 5.8 mu m, deposited using a radio-frequency (RF) magnetron sputtering system is much thicker than conventional bimorph structures. The characteristics of the two piezoelectric layers were similar to each other and revealed good electric and ferroelectric characteristics with a remanent polarization of 20 mu C cm(-2) and a coercive electric field of 50 kV cm(-1). PZT/PZT bimorph cantilevers were fabricated in order to evaluate their characteristics for actuator applications. The residual stress of the bimorph cantilever was reduced by an annealing process. The vibration test on the fabricated bimorph cantilevers during electrical voltage application revealed a twice as large displacement as compared with a single layer actuation, and the piezoelectric coefficient value d(31) was estimated to be -61 pm V-1, which is better than the value of conventional PZT/PZT bimorph cantilevers (-13 pm V-1). It was also shown that the influence of the temperature change is much less than that in unimorph structures with similar dimensions. The evaluated results demonstrate that the PZT/PZT bimorph structures are effective as MEMS devices.
机译:我们研究了增加包含双层Pb(Zr,Ti)O-3(PZT)薄膜的双压电晶片结构的厚度的影响。厚的PZT膜允许高压施加(例如在矫顽电场和击穿电压方面)和大的产生力,这在微机电系统(MEMS)应用中很有效。沉积条件和电极结构的改善促进了薄膜PZT / PZT双压电晶片结构的制造。使用射频(RF)磁控溅射系统沉积的总厚度为5.8μm的PZT / PZT双压电晶片比常规双压电晶片结构厚得多。两个压电层的特性彼此相似,并显示出良好的电和铁电特性,剩余极化强度为20μC cm(-2),矫顽电场为50 kV cm(-1)。制造PZT / PZT双压电晶片悬臂以评估其在执行器应用中的特性。通过退火工艺可以降低双压电晶片悬臂的残余应力。施加电压时对制成的双压电晶片悬臂的振动测试显示,位移是单层驱动的两倍,压电系数值d(31)估计为-61 pm V-1,优于常规PZT / PZT双压电晶片悬臂(-13 pm V-1)的值。还表明,温度变化的影响远小于尺寸相似的单晶结构。评估结果表明,PZT / PZT双压电晶片结构可有效用作MEMS器件。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号